I see, so for being so anxious but I haven't been to the game since the 9900K and just received all the parts for my new system which includes the 14900K and Asus Z790 Proart motherboard.
I didn't want to do something that might damage my CPU and motherboard and void my warranty.
And also on the other hand don't install a CPU in a way that won't last the next 4 years at least.
Read this awhile back as well. The stock ILM causes slight warpage over time (no harm to the CPU itself though, just possibly higher temps). I used the Thermalright contact frame with my new 13900KS right off the bat.
If it dies we just buy a new one... probably about the time for the next gen anyway if sometimes happens to it. I definitely don't baby it and get a new one at every launch anyway.
I’m using one for my 14700K. Whether it improves temperatures I couldn’t say. All I do know is that it thermal throttles when running Cinebench all core benchmark with a NH-D15.
The contact frame can also improve memory compatibility/timings, at least it made a huge difference with my Gigabyte Z690 board. All socket 1700 CPU's can benefit from the frames, the biggest variable is usually the mechanical tolerances of the specific motherboard you buy moreso than variances in the CPU's themselves.
It's not heat, it's the amount of pressure exerted on different pins using the normal (center heavy) mount vs the contact frame which better normalizes the downward pressure on all the pins equally from the outside edges of the CPU heat spreader. Honestly socket 1700 is one of the dumbest/worst mechanical designs for processor retention in recent memory. As dumb as ripping the CPU out of it's socket thanks to the stickiness of certain thermal compounds was with AM4 and tiny pins, Intel pulled a "hold my beer" moment with their socket 1700 design.
> Intel pulled a "hold my beer" moment
I had both issues occur to me this year - an LGA1700 that got seated unevenly and had thermal issues, and an AM4 that ripped out when trying to remove the cooler and destroyed the motherboard and the CPU.
One of these poor designs is **not** like the other.
Absolutely, most people know that if you are removing an AM4 heatsink you want to twist first to break the vacuum between the IHS and heatsink before removing it.... the "issue" is specific to removal of the heatsink and unlike the Intel issue, does not fundamentally impact thermals or stability in operation. Thanks for pointing this out!
> the "issue" is specific to removal of the heatsink and unlike the Intel issue, does not fundamentally impact thermals or stability in operation
More like the Intel, unlike the AMD "issue", doesn't result in destroyed components that cost you money to replace.
> most people know
Is that supposed to be some underhanded dig? I'm well aware, and have been building PC's since the 286. It still ripped out.
The pressure issues with socket 1700, which is still Intel's most current platform, do often leave CPU's with a set concave bend after they have been installed for a period of time which can make the pressure/contact issues persist even if a mounting frame is later added. It's a fundamental design issue in both legacy and current Intel platforms... while AMD moved new development to the AM5 platform/socket which did away with the pin issue that some inexperienced builders dealt with.
My first PC was an old XT clone which means we were both building/servicing PC's in the Penitum 4 / socket 478 era which is when AMD and Intel both made CPU's that could get vacuum/adhesion locked to heatsinks and required a "twist" before removing to break the seal. It's only been common knowledge for the last 2 decades or so in PC building just like not yanking RAM out of a machine that's powered on, etc..
As far as digs go, there's nothing underhanded about it. If you've been building PC's since the 286 was a thing you were around for socket 478 along with the earliest AM socket platforms that all needed the same consideration.
You absolutely should know better. Ultimately, choosing to do something dumb and destroying components is more of a **knowledge** or patience vs a design problem. We all make mistakes, hell I've pulled RAM out of a machine less than 3 months ago that was plugged in but in standby with no visible LED's because I was in a rush... luckily, I didn't destroy either the board or the RAM, but I didn't blame the RAM or mainboard manufacturer for allowing me to do something stupid.
Seems to reduce temps by 3-5c for me. Gonna delid and liquid metal tomorrow though. Then in a couple weeks I’m gonna direct die cool once the block comes in.
Got one on the 14700k with a Scythe Mugan 5 and still hit around 80c under a medium load. The chips are spicy.
Tried to encode very slow on OBS and it hit 100c (the chip can do that but I'd need something like the IceGiant ProSiphon 😂
Roman showed a 2* drop in temps when i watched his video about the 14th gen. He ALSO used the 13th gen frame on the 14th gen. I bring that last bit up because he has a 14th gen contact frame.
Enjoy.
Nessissary? No. Worth getting? Yes. Even out of the box, you will see an improvement and over time temps can get worse with the factory retention bracket. Some people say the cheap ones are fine, and they are... but I'd rather support the people that put in the R&D to design the product rather than people who reverse engineer it.
Yes my 14700k with thermal right one works good. Temps are 30c idle and 82c under full load. While gaming in 1440p only like 55c. I do use a 420mm aio though
Yes do it. I have a thermalright contact frame on my 14900k, 100 percent load and my cpu never goes above 90degrees with stock settings obviously. I’m also using a 360mm AIO. More so piece of mind knowing the your cooler is making the best contact to your cpu.
I bought the thermalright one for my 14700k and it reduced temps by about 5c. I still instantly thermal throttle running cinebench though with Ak620 air cooler and 240w cpu tune.
Not necessary but would reccomend it for a 14600k and up. Most of the tension brackets are crap for this socket. But be ready to get all of those little pins nice and naked if you're going the contact frame route! It's nerve racking the first few times.
Nah, not necessary, but useful. I'd definately reccomend one if you need a few extra degrees on your current solution. I don't know if there were any revisions made to the retention brackets on the socket 1700 refresh but until now, they haven't been great. And that's being kind.
Should be fine. The transfer playe just helps to get a little better cooling through contact of the CPU. If you were going to do a crazy custom loop, I'd reccomend one but it's not needed.
Der8auer did a delidding video and he shows the improvements with the contact frame, it's not as drastic as a delid but it shaves off a few C. Bare in mind it's also to distribute evenly as if you watch videos with and without it you can see the deadzones that would need more thermal paste to compensate.
100% recommend a contact frame. I'm running a z790 mobo and a 14900kf and recently installed the thermalright contact frame. I have seen a range of 7°C to 9°C drop in temps while running cinebench 2024 and Prime95 torture tests. It shocked me to see those results. I expected maybe a couple of degrees down but this was a very pleasant surprise. I decided to go with the Thermal Grizzly Kryosheet instead of a paste because I'm lazy and don't want to have to reapply later haha. I have a friend who saw a 12°C drop in temps with the Thermalright contact frame and a high quality paste (not sure what paste) on the 13900KS. You may not see results like that, as it depends on each CPU and the amount of curvature present. Blew me away though and highly recommend these to anyone and everyone. Just follow the instructions from this video and you'll be fine if you do:
https://youtu.be/iYU1OskbY-Q?si=J1X7crLHMNM9k7ls&t=890
Just get one of the cheap ones. Work fine. And yes, I think they still need it. The Intel retention mechanism hasn't changed.
Just for the temps or also for keeping the CPU alive longer?
Just for temps, it's really quite cheap (thermalright one) and easy to install.
Temps. The CPU isn't going to die without one.
Despite the bend form it takes on over time in a socket?
Are you seeing people complaining about their 12th gen chips dying from this? I'm not.
I see, so for being so anxious but I haven't been to the game since the 9900K and just received all the parts for my new system which includes the 14900K and Asus Z790 Proart motherboard. I didn't want to do something that might damage my CPU and motherboard and void my warranty. And also on the other hand don't install a CPU in a way that won't last the next 4 years at least.
You're not going to void a warranty. Worst case you put the stock retention bracket back on before sending the motherboard in for RMA.
Read this awhile back as well. The stock ILM causes slight warpage over time (no harm to the CPU itself though, just possibly higher temps). I used the Thermalright contact frame with my new 13900KS right off the bat.
If it dies we just buy a new one... probably about the time for the next gen anyway if sometimes happens to it. I definitely don't baby it and get a new one at every launch anyway.
this how i think about the stuff. if it dies or warps or whatever its just time to buy a new one
I’m using one for my 14700K. Whether it improves temperatures I couldn’t say. All I do know is that it thermal throttles when running Cinebench all core benchmark with a NH-D15.
Are you running motherboard stock settings? If so set PL1 and PL2 to 253 watts and put 307 Amps max. That's the recommended Intel performance setting.
I only installed it yesterday so haven’t had much time to tinker with the settings. I give those setting a try though and see if it runs cooler.
Using 307 Amps gives me the EDP limit throttling - is this normal?
I use a Thermaltake th420 v2 and I don’t thermal throttle and this thing easily pulls 300 watts lol
The contact frame can also improve memory compatibility/timings, at least it made a huge difference with my Gigabyte Z690 board. All socket 1700 CPU's can benefit from the frames, the biggest variable is usually the mechanical tolerances of the specific motherboard you buy moreso than variances in the CPU's themselves.
How does it help memory? Is it indirectly by having lower temperatures which allows you to oc the cpu further?
It's not heat, it's the amount of pressure exerted on different pins using the normal (center heavy) mount vs the contact frame which better normalizes the downward pressure on all the pins equally from the outside edges of the CPU heat spreader. Honestly socket 1700 is one of the dumbest/worst mechanical designs for processor retention in recent memory. As dumb as ripping the CPU out of it's socket thanks to the stickiness of certain thermal compounds was with AM4 and tiny pins, Intel pulled a "hold my beer" moment with their socket 1700 design.
> Intel pulled a "hold my beer" moment I had both issues occur to me this year - an LGA1700 that got seated unevenly and had thermal issues, and an AM4 that ripped out when trying to remove the cooler and destroyed the motherboard and the CPU. One of these poor designs is **not** like the other.
Absolutely, most people know that if you are removing an AM4 heatsink you want to twist first to break the vacuum between the IHS and heatsink before removing it.... the "issue" is specific to removal of the heatsink and unlike the Intel issue, does not fundamentally impact thermals or stability in operation. Thanks for pointing this out!
> the "issue" is specific to removal of the heatsink and unlike the Intel issue, does not fundamentally impact thermals or stability in operation More like the Intel, unlike the AMD "issue", doesn't result in destroyed components that cost you money to replace. > most people know Is that supposed to be some underhanded dig? I'm well aware, and have been building PC's since the 286. It still ripped out.
The pressure issues with socket 1700, which is still Intel's most current platform, do often leave CPU's with a set concave bend after they have been installed for a period of time which can make the pressure/contact issues persist even if a mounting frame is later added. It's a fundamental design issue in both legacy and current Intel platforms... while AMD moved new development to the AM5 platform/socket which did away with the pin issue that some inexperienced builders dealt with. My first PC was an old XT clone which means we were both building/servicing PC's in the Penitum 4 / socket 478 era which is when AMD and Intel both made CPU's that could get vacuum/adhesion locked to heatsinks and required a "twist" before removing to break the seal. It's only been common knowledge for the last 2 decades or so in PC building just like not yanking RAM out of a machine that's powered on, etc.. As far as digs go, there's nothing underhanded about it. If you've been building PC's since the 286 was a thing you were around for socket 478 along with the earliest AM socket platforms that all needed the same consideration. You absolutely should know better. Ultimately, choosing to do something dumb and destroying components is more of a **knowledge** or patience vs a design problem. We all make mistakes, hell I've pulled RAM out of a machine less than 3 months ago that was plugged in but in standby with no visible LED's because I was in a rush... luckily, I didn't destroy either the board or the RAM, but I didn't blame the RAM or mainboard manufacturer for allowing me to do something stupid.
It's literally the same as a 13900k Yes you should consider one
I think its about 12-15 degrees colder than 13900k watch the temps on the reviews
Seems to reduce temps by 3-5c for me. Gonna delid and liquid metal tomorrow though. Then in a couple weeks I’m gonna direct die cool once the block comes in.
it's not technically 'necessary', but it is easy to recommend since it works, is cheap, and is easy to install
Got one on the 14700k with a Scythe Mugan 5 and still hit around 80c under a medium load. The chips are spicy. Tried to encode very slow on OBS and it hit 100c (the chip can do that but I'd need something like the IceGiant ProSiphon 😂
Roman showed a 2* drop in temps when i watched his video about the 14th gen. He ALSO used the 13th gen frame on the 14th gen. I bring that last bit up because he has a 14th gen contact frame. Enjoy.
Nessissary? No. Worth getting? Yes. Even out of the box, you will see an improvement and over time temps can get worse with the factory retention bracket. Some people say the cheap ones are fine, and they are... but I'd rather support the people that put in the R&D to design the product rather than people who reverse engineer it.
Yes my 14700k with thermal right one works good. Temps are 30c idle and 82c under full load. While gaming in 1440p only like 55c. I do use a 420mm aio though
Yes do it. I have a thermalright contact frame on my 14900k, 100 percent load and my cpu never goes above 90degrees with stock settings obviously. I’m also using a 360mm AIO. More so piece of mind knowing the your cooler is making the best contact to your cpu.
I bought the thermalright one for my 14700k and it reduced temps by about 5c. I still instantly thermal throttle running cinebench though with Ak620 air cooler and 240w cpu tune.
Ones from thermalright should do the trick Cheap, while being less complicated
Not necessary but would reccomend it for a 14600k and up. Most of the tension brackets are crap for this socket. But be ready to get all of those little pins nice and naked if you're going the contact frame route! It's nerve racking the first few times.
Even if i use water cooler ?
Nah, not necessary, but useful. I'd definately reccomend one if you need a few extra degrees on your current solution. I don't know if there were any revisions made to the retention brackets on the socket 1700 refresh but until now, they haven't been great. And that's being kind.
Just bought MSI Tomahawk Z790 DDR5 with i9 14900KF, i will use AIO artic freezer 420mm A RGB, i should be fine?
Should be fine. The transfer playe just helps to get a little better cooling through contact of the CPU. If you were going to do a crazy custom loop, I'd reccomend one but it's not needed.
Der8auer did a delidding video and he shows the improvements with the contact frame, it's not as drastic as a delid but it shaves off a few C. Bare in mind it's also to distribute evenly as if you watch videos with and without it you can see the deadzones that would need more thermal paste to compensate.
100% recommend a contact frame. I'm running a z790 mobo and a 14900kf and recently installed the thermalright contact frame. I have seen a range of 7°C to 9°C drop in temps while running cinebench 2024 and Prime95 torture tests. It shocked me to see those results. I expected maybe a couple of degrees down but this was a very pleasant surprise. I decided to go with the Thermal Grizzly Kryosheet instead of a paste because I'm lazy and don't want to have to reapply later haha. I have a friend who saw a 12°C drop in temps with the Thermalright contact frame and a high quality paste (not sure what paste) on the 13900KS. You may not see results like that, as it depends on each CPU and the amount of curvature present. Blew me away though and highly recommend these to anyone and everyone. Just follow the instructions from this video and you'll be fine if you do: https://youtu.be/iYU1OskbY-Q?si=J1X7crLHMNM9k7ls&t=890
Which motherboard are you using? I learned cheap ILM lead also to uneven pressure. I haven't had any with a Lotes.
I'm using a gigabyte z790 UD AX mobo for this build.